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73M2901/5v advanced single chip modem description the 73M2901/5v is a single - chip modem that combines all the controller (dte) and data pump functions necessary to implement an intelligent v.22bis data modem. this device is based on tdk semiconducto r?s implementation of the industry standard 8032 microcontroller core with a proprietary multiply and accumulate (mac) coprocessor; sigma - delta a/d and d/a converters; and an analog front end. the rom and ram necessary to operate the modem are contained o n the device. additionally, the 73M2901/5v provides an on - chip oscillator and hybrid driver. the 73M2901/5v is a high performance, low voltage, low power, single chip modem capable of data transmission and reception through 2400bps. the 73M2901/5v is inte nded for embedded applications and battery operation. this device offers options for a low power conventional 5 volt design with optional internal hybrid and country specific call progress support. features low overall system chip count. true one chip so lution for embedded systems low operating power (~250mw @ 5v, automatic low power standby and power down options available) internal rom and ram for normal operation on chip optional hybrid driver designed for +5 volts (+/ - 10%) data speeds: v.22bis ? 2400b ps v.22, bell 212 ? 1200bps v.21, bell 103 ? 300bps v.23 ? 1200/75bps (w/ turnaround (pavi)) bell 202 ? 1200bps bell 202 and v23 4 - wire operations dynamic range: - 9dbm to ? 43 dbm ?at? command set host access to modem port pins via at commands for custom i/ o expansion dtmf tone generation and detection call progress support with multinational options (fcc68, ctr21, jate?) caller id capability blacklisting capability packaging: 32 pin plcc or 44 pin tqfp block diagram rom mac ram cpu afe hybrid rxa txap txap hbden txclk asrch ring dtr ri cts dcd dsr rts rxclk txd rxd usr10 usr11 relay august 2001 tdk semiconduct or corp . ?
73M2901/5v advanced single chip modem 2 hardware description the 73M2901/5v is designed for a single +5 volt supply with low power consumption (~250mw @ 5 volts). the modem supports automatic standby idle mode. the modem will also accept a request to power down from the dte via hardware control. no additional major components a re required to complete the modem core logic. the modem provides direct firmware led support via port pins. hardware features fully self - contained. ?at? command interpreter and data pump user pin available synchronous serial data i/o available asynchrono us serial port on - chip hybrid driver. autobaud capability from 300bps to 9600bps power supply power is supplied to the 73M2901/5v via the vpd and vpa pins. the 73M2901/5v is designed for a single +5 (+/ - 10%) volt supply and for low power consumption (~250 mw @ 5 volts). ground reference is provided at the vnd and vna pins. low power mode the tdk 73M2901/5v supports a low power mode. if the low power standby option is enabled the 73M2901/5v will go into a power saving mode when idle. the oscillator will be running, clocks will be supplied to the uart, timers and interrupt blocks; but no clocks will be supplied to the cpu. instruction processing and activity on the internal busses is halted. normal operation is resumed when an interruption such as dtr , rin g or asrch (any character send to the 73M2901/5v) is requested or when a reset occurs. analog line / hybrid interface the 73M2901/5v provides a differential analog output (txap and txan) and a single - ended analog input (rxa) with internal a/d and d/a conve rters. a driver is provided for an internal hybrid function. the internal hybrid driver is capable of driving an external load matching impedance and a line - coupling transformer. if an external hybrid is to be used, the on - chip hybrid drivers can be recon figured to drive a minimum load of 50k w and thus reduce the driver?s power consumption. the hybrid configuration is controlled by the state of the hbden pin. for driving a line - coupling transformer, hbden should be pulled high. for driving an external h ybrid (load on txap and txan is 50k w or larger), hbden should be pulled low. the 73M2901/5v provides firmware control for a hook relay driver ( relay ) as well as interrupt support for a ring detect opto - coupler ( ring ). interrupt pins the external interrupt sources, dtr , asrch and ring , come from dedicated input pins of the same name. dtr informs the 73M2901/5v that the host has requested the 73M2901/5v perform a specific function. the actual particulars of that function can be changed by ?at? commands (des cribed in full in the tdk 73M2901 user?s guide). asrch informs the 73M2901/5v that the host is passing data to the 73M2901/5v over the dte interface. this instructs the 73M2901/5v to begin looking for valid ?at? commands. this pin needs to be connected to the txd pin. ring informs the 73M2901/5v that the external daa circuitry has detected a ring signal. crystal oscilator the tdk 73M2901/5v single chip modem can use an external 11.0592 mhz reference clock or can generate such a clock using only a crystal and two capacitors. if an external clock is used, it should be applied to oscin. specifying a crystal the manufacturer of a crystal resonator verifies its frequency of oscillation in a test set - up, but to ensure that the same frequency is obtained in the application, the circuit conditions must be the same. the tdk 73M2901/5v modem requires a parallel mode (antiresonant) crystal, the important specifications of which are as follows: mode: parallel (antiresonant) frequency: 11.0592 mhz frequency tole rance: 50 ppm at initial temperature. temperature drift: 50 ppm additional over full range. load capacitance: 18pf or 20pf esr: 75 w max. drive level: less than 1mw.
73M2901/5v advanced single chip modem 3 reset a reset is accomplished by holding the reset pin high. to ensure a proper power - o n reset, the reset pin must be held high for a minimum of 3 m s. at power on, the voltage at vpd, vpa, and reset must come up at the same time for a proper reset. asynchronous and syn chronous serial data interface the serial data interface consists of th e txd and rxd data paths (lsbit shifted in and out first, respectively); and the txclk and rxclk serial clock outputs associated with the data pins; cts / rts flow control; dcr , dsr and dtr . in synchronous mode, the data is passed at the bit rate (tolerance is +1%, - 2.5%). pin descriptions power pin descriptio n pin name 32 - pin 44 - pin type description vpa 15 16 i positive analog voltage (+ analog supply) vna 21 22 i negative analog voltage. (analog ground) vpd 6, 25, 29 2,12, 27, 33 i positive digital voltage (+ digital supply) vnd 5, 22, 26 11, 24, 44, 28 i negative digital voltage. (digital ground) analog interface pin description pin name 32 - pin 44 - pin type description rxa 20 21 i receive analog data txan 16 17 o transmit analog - txap 17 18 o transmit analog + hbden 14 15 i 2w/4w hybrid driver enable pin 0 = driver configured for 50k w or greater load (tie to vnd) 1 = driver configured for driving line - coupling transformer (tie to vpd) vbg 19 20 o analog band gap voltage reference pin (0 .1 m f to vna) vref 18 19 o analog reference voltage pin (0.1 m f to vna) external interrupts pin descriptions pin name 32 - pin 44 - pin type description ring asrch dtr 2 1 32 39 38 37 i i i external interrupt ? line interface ring detection circuitry input e xternal interrupt ? autobaud detection, connected to txd external interrupt ? dte dtr signal input
73M2901/5v advanced single chip modem 4 pin descriptions ( continued ) oscillator pin descr iption pin name 32 - pin 44 - pin type description oscin 24 26 i crystal input for internal oscillator, also input for external source. oscout 23 25 o crystal oscillator output. digital interface pi n description pin name 32 - pin 44 - pin type description reset 13 9 i resets 73M2901/5v rxclk 31 36 o receive data synchronous clock rxd 30 35 o serial output to d te. txclk 28 31 o transmit data synchronous clock txd 27 30 i serial data input from dte. usr10 12 8 i/o this pin can optionally be configured as an active low detect pin. this can be used to implement such functions as ?parallel - pick - up?, ?line - in - use ?, or ?seize? detect. usr11 11 7 i/o programmable i/o port. this pin can ooptionnaly be used to control an external switch for caller id decoding operations. rts (usr12) 10 6 i request to send cts (usr13) 9 5 o clear to send dsr (usr14) 8 4 o data set ready dcd (usr15) 7 3 o data carrier detect ri (usr16) 4 43 o ring indicator relay (usr17) 3 40 o relay driver output
73M2901/5v advanced single chip modem 5 electrical specifica tions absolute maximum rat ings operation above maximum rating may permanently damage the device . parameter rati ng supply voltage - 0.5v to +7.0v pin input voltage - 0.5v to vpd + 0.5v storage temperature - 55oc to 150c recommended operatin g conditions parameter rating supply voltage +5.0v (+/ - 10%) oscillator frequency 11.0592mhz +/ - 50ppm operating temperature - 40c to +85c transmitter parameter conditions min nom max unit itu guard tone power 550hz (relative to carrier) 1800hz (relative to carrier) - 5 - 8 - 3.5 - 6.5 - 2 - 5 db db calling tone 1300hz - 11 - 9.0 dbm0 1 answer tone power 2225/2100hz - 11 - 9.0 dbm0 1 dtmf transmit power high band tones low band tones - 8.0 - 10 - 6.0 - 8.0 dbm0 1 1 dbm0 refers to the tdk recommended daa ( 8db loss from transmit pins to the line and 5db loss from the line to the receive pin). results may vary depending on selected daa. 0dbm = 0.775v rms . dbm = 10log {vrms 2 /[(1mw)(600o)] }
73M2901/5v advanced single chip modem 6 electrical specifica tions ( continued) maximum transmit levels vref=2.25v; vpa=5.0v transmit type maximum differential line level (dbm0) qam - 5.5 dpsk - 3.4 fsk - 1.2 dt mf (high tone) - 6.0 dtmf (low tone) - 8.0 dtmf (total) - 3.9 vref=1.25v; vpa=5.0v qam - 9.6 dpsk - 7.4 fsk - 5.3 dtmf (high tone) - 7.9 dtmf (low tone) - 9.8 dtmf (total) - 5.7 note: the recommended daa (see the tdk 73M2901 reference manual) will res ult in approximately 8db loss from the transmit pins to the phone line. this includes the loss through the line matching impedance (475 w resistor), transformer, and solid state off - hook relay.
73M2901/5v advanced single chip modem 7 electrical specifica tions (continued) transmitter parameter c onditions min nom max unit gain adjust tolerance by step - 0.3 0 0.3 db transmit gain boost sfr 96h bit 1 (txboost) = 1 4.8 5.1 5.4 db total harmonic distortion (thd) 1khz sine wave at output (txap - txan) 1.5vpk(2.7dbm) for vref=1.25v 2.4vpk (6.8dbm) for vref=2.25v thd = 2 nd and 3 rd harmonic. - 50 db each unwante d frequency component - 33 db intermod distortion at output (txap - txan) 1.0khz, 1.2 khz sine waves summed 2.0vpk for vref=1.25v 2.4vpk for vref=2.25v refer to ctr21 specification for complete description of requirements sum of unwanted frequency components in pass band - 20 db below low tone power supply rejection ratio - 30 dbm signal at vpa 300hz ? 30khz. measured txap to txan. 30.0 db receiver parameter conditions min nom max unit carrier detect on tip and ring - 43.0 dbm0 1 carrier detect off tip and ring - 48.0 dbm0 1 carrier detect hysteresis tip and ring 2.0 db receive level tip and ring - 43.0 - 9.0 dbm0 1 idle channel noise 0.2khz - 4.0khz - 70 - 65 db
73M2901/5v advanced single chip modem 8 elec trical specification s ( continued ) receiver ( continued ) parameter test condition min nom max units input impedance rxa 150 --- --- k w receive gain boost sfr 96h bit 2 (rxgain) = 1 2.7 3.0 3.3 db vref=1.25v 0.587 vpk maximum input level at rxa vref=2. 25v 1.069 vpk total harmonic distortion (thd) 1khz 450mv - pk on rxa thd = 2 nd and 3 rd harmonic. - 70 - 50 db dc characteristics parameter symbol condition min nom max unit input low voltage (except oscin,reset) vil - 0.5 0.2vcc v input low voltage oscin,reset vil - 0.5 0.2 vcc v input high voltage (except oscin,reset) vih 0.5 vcc vcc + 0.5 v input high voltage oscin,reset vih 0.7 vcc vcc + 0.5 v output low voltage (except oscout) vol iol = 4ma 0.45 v output low voltage oscout volosc iol = 3.0ma 0.7 v output high voltage (except oscout) voh ioh = - 4ma vcc ? 0.45 v output high voltage oscout vohosc ioh = - 3.0ma vcc ? 0.9 v input leakage current (except oscin) iih vss < vin < vcc 1 m a input leakage current oscin iih vss < vin < vcc 1 30 m a
73M2901/5v advanced single chip modem 9 electrical specifica tions (continued) dc characteristics parameter symbol condition min nom max unit 5v operations maximum power supply normal operation @ 5v hbden pulled high idd1 30pf/pin 51 62 ma maximum power supply normal operation @ 5v hbden pulled low idd1 30pf/pin 35 43 ma maximum digital power supply @ 5v iddd 30pf/pin 31 37 ma maximum analog power supply @ 5v hbden pulled high iddah1 30pf/pin 20 25 ma maximum analog power supply @ 5v hbden pulled low iddah0 30pf/pin 4 6 ma maximum power supply idle mode @ 5v idd2 30pf/pin 11 15 ma maximum power supply power down mode @ 5v idd3 30pf/pin 4 10 m a dc characteristics parameter condition min nom max unit vbg vcc=5v 1.19 1.25 1.31 v vref vcc=5v ? no boost 1.19 1.25 1.31 v vref vcc=5v + internal boost 2.14 2.25 2.36 v 5 volts detection threshold 3.8 4.2 4.5 v
73M2901/5v advanced single chip modem 10 firmware description 2 an ?at? command interpreter provides command and configuration of the 73M2901/5v. this provides the user a uniform interface to control t he modem in embedded applications. the signal processing is performed by obtaining data from and providing data to the integrated a/d converter. a mac hardware processor is provided for computation. to provide maximum flexibility, the system host process or can access the internal ram and control register space in the modem. this will allow the oem user to modify parameters such as filter response, transmit levels through the at command set using proprietary commands. the host processor can also access t he modem i/o port pins, providing extended i/o capability. firmware requirement s the modem always powers up in the idle (on hook) mode. ?at? commands are issued via the serial interface from the host. all modem configuration commands are received in this manner. the data modem firmware is contained in an internal rom. the firmware will automatically enter a power saving idle mode if the modem is on hook and there are no incoming host commands. the modem automatically powers up upon receiving the next c ommand. this power up sequence occurs without delay to the host. this function, while saving power, is transparent to the host processor and can be disabled by the host via an ?at? command. the host can also program the modem to power down via external pin ( dtr ) or via a firmware command. 2 for a detailed description of the firmware consult the tdk 73M2901 user?s manual. firmware features ?at? command set supports data standards through v.22bis provides daa control firmware (e.g. ring detect, hook control, line in use detection support) multinational call progress support (fcc68, ctr21 , jate?) caller id capability fsk demodulation (v23 or bell202) intra 1 st /2 nd ring cid data operations post line reversal cid data operations interfaces with standard v.24/eia - 232 (3 - 5 volt inverted level) serial interface using the built in serial port and firmware control of port pins provides tone generation and detection, four imprecise and four precise call progress detect filters host access to program ram provided user access to modem functions
73M2901/5v advanced single chip modem 11 design consideration s tdk semiconductor?s single chi p modem solutions include all the basic modem functions. this makes these devices adaptable to a variety of applications. unlike digital logic circuitry, modem designs must contend with precise frequency tolerances and verify low level analog signals, t o ensure acceptable performance. using good analog circuit design practices will generally result in a sound design. the crystal oscillator should be held to a 50ppm tolerance. following are additional recommendations that should be taken into considera tion when starting new designs. layout consideration s good analog/digital design rules must be used to control system noise in order to obtain high performance in modem designs. the more digital circuitry present in the application, the more attention t o noise control is needed. high speed, digital devices should be locally bypassed, and the telephone line interface and the modem should be located next to each other near where the telephone line connection is accessed. it is recommended that power supp lies and ground traces should be routed separately to the analog and digital portions on the board. digital signals should not be routed near low level analog or high impedance analog traces. the 73M2901/5v should be considered a high performance analog device. a 10 m f electrolytic capacitor in parallel with a 0.1 m f ceramic capacitor should be placed between vpd and vnd as well as between vpa and vna. a 0.1 m f ceramic capacitor should be placed between vref and vna as well as vbg and vna. use of ground p lanes and large traces on power is recommended. the 73M2901/5v is the first of a series of parts with different and/or additional features. in order to insure full lay out compatibility for all the series, it is recommended to implement three additional re sistors in the schematics as shown in the recommended schematics arrangement (r11, r12 and r13). telephone line inter face transmit levels at the line are dependent on the interface used between the pins and the line. in order to save having to provide ext ernal op - amps to drive the line coupling transformer, the analog outputs (txap and txan) have the capability to be used as the hybrid drivers for connecting to the transformer directly (with the required impedance matching series resistor). used in this c onfiguration, there is loss associated in both the receive path and transmit path. the line interface circuit shown on the following page represents the basic components and values 3 for interfacing the tdk 73M2901/5v analog pins to the telephone line. mo dem performance characteristics the curves presented in this data sheet define modem ic performance under a variety of line conditions typical of those encountered over public service telephone lines. ber vs. snr this test represents the ability of the m odem to operate over noisy lines with a minimum amount of data transfer errors. since some noise is generated in the best dial up lines, the modem must operate with the lowest signal to noise ratio (snr) possible. better modem performance is indicated by test curves that are closest to the ber axis. a narrow spread between curves representing the four line parameters indicates minimal variation in performance while operating over a range of aberrant operating conditions. typically a dpsk modem will exhi bit better ber performance test curves receiving in the low band (answer mode) than in the high band (originate mode). ber vs. receive leve l this test measures the dynamic range of the modem. because signal levels vary widely over dial up lines, the w idest possible dynamic range is desirable. the snr is held constant at the indicated values as the receive level is lowered from very a very high to a very low signal level. the width of the bowl of these curves, taken at the ber point is the measure of the dynamic range. 3 tdk73M2901 demo boards use the line interface shown on the following page. other designs may have different requirements and thus will require different component valu es or a different configuration. with the shown configuration, there is approximately an 8db loss in the transmit path, and approximately a 5db loss in the receive path.
73M2901/5v advanced single chip modem 12 t elephone line t1 5.1k r4 r3 21k r1 txap rxa txan 475 c1 0.033 m midcom 671-8005 recommended line interface r2 21k pri r4 470 r3 5.1k c4 100nf gnd jp1 header 10 1 2 3 4 5 6 7 8 9 10 r1 10k gnd vcc gnd r13 nc y1 11.0592 mhz u1 2901_p32 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 asrch ring relay ri vnd vpd dcd dsr cts rts usr11 usr10/liu rst hbden vpa txan txap vref vbg rxa vna vnd oscout oscin vpd vnd txd txc vpd rxd rxc dtr vpa vna vcc vcc + c2 10uf 1 2 t1 671-8005 1 4 2 3 to --> rs232 level shifter --> host microprocessor vcc r12 0r ttl v24 signals interface r11 0r c7 .033uf sec c5 100nf c1 27pf c3 33pf gnd gnd recommended schematics arrangement
73M2901/5v advanced single chip modem 13 typical usa applicat ion schematics
73M2901/5v advanced single chip modem 14 ber vs snr ber vs r eceive level v.22bis 3002a line, 5.0v, 25c v.22bis 3002a line, 5.0v, 25c 1.00e+00 1.00e-01 1.00e-02 1.00e-03 1.00e-04 4 10 11 12 13 14 15 16 17 18 19 8 12 16 20 24 28 32 36 40 44 1.00e-05 1.00e-06 1.00e+00 1.00e-01 1.00e-02 1.00e-03 1.00e-04 1.00e-05 1.00e-06 receive level (dbm) snr (rx signal/3k hz) (db) bit error rate originate answer bit error rate originate answer
73M2901/5v advanced single chip modem 15 32 pin plcc pin - out pin pin name pin pin name 1 asrch 17 txap 2 ring 18 vref 3 relay 19 vbg 4 ri 20 rxa 5 vnd 21 vna 6 vpd 22 vnd 7 dcd 23 oscout 8 dsr 24 oscin 9 cts 25 vpd 10 rts 26 vnd 11 usr11 27 txd 12 usr10 28 txclk 13 reset 29 vpd 14 hbden 30 rxd 15 vpa 31 rxclk 16 txan 32 dtr 44 pin tqfp pin - out pin pin name pin pin name pin pin name pin pin name 1 n/c 12 vpd 23 n/c 34 n/c 2 vpd 13 n/c 24 vnd 35 rxd 3 dcd 14 n/c 25 oscout 36 rxclk 4 dsr 15 hbden 26 oscin 37 dtr 5 cts 16 vpa 27 vpd 38 asrch 6 rts 17 txan 28 vnd 39 ring 7 usr11 18 txap 29 n/c 40 relay 8 usr10 19 vref 30 txd 41 n/c 9 reset 20 vbg 31 txclk 42 n/c 10 n/c 21 rxa 32 n/c 43 ri 11 vnd 22 vna 33 vpd 44 vnd
73M2901/5v advanced single chip modem 16 mechanical drawings 32 - pin plcc
73M2901/5v advanced single chip modem 17 mechanical drawings (continued) 44 - pin tqfp (jedec lqfp)
73M2901/5v advanced single chip modem 18 package pin designat ions (top view) 3 2 - lead plcc 44 - pin tqfp 73M2901 - 32ih/5 73m2 901 - igt/5 ordering information part description order number packaging mark 73M2901/5v 32 - pin plastic leaded chip carrier 73M2901 - 32ih/5 73M2901 - 32ih 73M2901/5v 44 - pin thin quad flat pack 73M2901 - igt/5 73m290 1 - igt no responsibility is assumed by tdk semiconductor corporation for use of this product nor for any infringements of patents and trademarks or other rights of third parties resulting from its use. no license is granted under any patents, patent rights or trademarks of tdk semiconductor corporation, and the company reserves the right to make changes in specifications at any time without notice. accordingly, the reader is cautioned to verify that the data sheet is current before placing orders. t dk semiconductor corp., 2642 michelle dr., tustin, ca 92780, (714) 508 - 8800, fax (714) 508 - 8877, www.tdksemiconductor.com tdk semiconductor corporation 08/30/01 rev. d revision: caution: use handling procedures necessary for a static sensitive component .
73M2901/5v advanced single chip modem 19 august 22, 2001 removed 5v pin callouts from package drawing. august 30, 2001 updated mechanical drawing

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